Aluminum Nitride Ceramic Platemerits
Aluminum nitride ceramic plate structural parts combine high thermal conductivity and high insulation perfectly, and are important basic materials in the field of high-power electronics and high-end packaging. It has high thermal conductivity and electrical insulation, so it can be used in various electronic devices. The most prominent advantage of aluminum nitride is that the thermal conductivity is much higher than that of alumina ceramics, which can quickly conduct heat away from chips and power devices. The thermal conductivity can reach 170-230 W/m-K, which is 5-8 times higher than that of alumina ceramics.
Description
Advantages of Aluminum Nitride Ceramic Plates
Aluminum Nitride Ceramic Plate structural parts have an overall flat solid structure with U-shaped precision grooves, which is suitable for applications such as heat dissipation, insulation, support and precision installation. Aluminum nitride ceramic plate has the characteristics of high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical resistance, high resistivity, low dielectric loss, etc. It is an ideal high temperature resistant insulating ceramic product. Aluminum nitride ceramics can replace toxic beryllium oxide ceramics and are widely used in the electronics industry.
- Provides stable support and a uniform thermal path for electronic packaging and structural mounting.
- U-shaped precision slots are designed to meet the needs of wire avoidance, device embedding, heat flow zoning, or installation positioning.
- The high flatness of the double-sided grinding surface is conducive to device attachment and improves thermal conductivity.
- Four corner mounting holes (customizable) for easy screw fixing and modular assembly.
- Rounded edges reduce stress concentrations and risk of chipping
Applications of Aluminum Nitride Ceramics
Aluminum Nitride (AlN) ceramics have high thermal conductivity and electrical insulation, so they can be used in a variety of electronic devices. Aluminum nitride has a thermal conductivity greater than 170W/(mk), good resistance to thermal shock, and can be used in high temperature environments up to 2200℃. Therefore, aluminum nitride ceramic products are ideal for many industries, such as:
- Radiators and heat sinks
- Electronics Packaging Substrates
- Substrates and insulators for microelectronic and optoelectronic devices
- Laser Thermal Management Components
- electrical insulation
- Molten Metal Fixture
Basic Properties of Aluminum Nitride Ceramics
Aluminum Nitride (AlN) is a covalently bonded compound, atomic crystal, diamond-like nitride, hexagonal crystal system, fibrillated zincite crystal structure, non-toxic, white or off-white.
- High thermal conductivity (>170W/m-K), close to BeO and SiC, more than 5 times that of Al2O3;
- The coefficient of thermal expansion matches that of Si and GaAs;
- Various electrical properties (dielectric constant, dielectric loss, body resistivity, dielectric strength) are excellent;
- Good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, can be sintered at atmospheric pressure;
- It can be produced by casting process and is a promising substrate and packaging material for high power integrated circuits.
Suppliers of Aluminum nitride ceramics
To Good Ceramics is a professional ceramic supplier, we have many years of experience in producing high quality precision ceramic parts. We utilize our experienced team and in-depth knowledge of ceramic materials to create the best precision ceramic products for our customers at competitive prices.
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