Aluminum nitride ceramics is a high-performance ceramic material made of aluminum nitride (AlN) as the main raw material and sintered at high temperature. Its most important feature is its high thermal conductivity (about 170-200 W/m-K), as well as excellent electrical insulation properties and a coefficient of thermal expansion close to that of silicon chips, which makes it very suitable for heat dissipation and encapsulation of electronic devices. Compared with traditional alumina ceramic chips, aluminum nitride ceramics have more advantages in terms of heat dissipation efficiency, reliability and service life. Due to its stable chemical properties and mechanical strength, Aluminum Nitride is widely used in power electronics, LED packaging, RF communications, automotive electronics and new energy equipment, etc. It is one of the indispensable basic materials in the modern electronics industry and high-end manufacturing field!

What is Aluminum Nitride Ceramics? -Advanced Ceramic Materials-Zihao Ceramics

Aluminum Nitride Ceramic Core Features

Aluminum nitride has a thermal conductivity of about 170-230 W/(m-K), which is much higher than that of traditional alumina ceramic sheets (only 18-35 W/(m-K)), allowing for rapid heat dissipation.

Resistivity >10^13 Ω-cm at room temperature ensures circuit isolation and avoids short circuits.

The coefficient of thermal expansion is about 4.5 x 10^-6/K, which is thermally matched to semiconductor materials such as silicon, reducing thermal stress and device failure.

It maintains good strength at 1000°C, not easy to soften or deform, suitable for high temperature working environment.

Chemically inert, highly stable to acids, alkalis and chemical media, not easily corroded, suitable for harsh environments.

The density of the material is about 3.26 g/cm³, which is only about half of that of stainless steel, reducing the weight of the equipment; high surface accuracy and compact structure after processing.

Technical Parameters

parameters numerical value
chemical formula (e.g. water H2O) AlN
crystal structure Hexagonal crystal system (fibrous zinc ore type)
intensity ≈3.26 g/cm³
melting point 3000 °C
thermal conductivity ≈170-230 W/(m-K)
relative permittivity ≈8.5
coefficient of thermal expansion 4.5 x 10^-6 /K
body resistivity >10^13 Ω-cm

Application Areas

  • Electronics and power electronics: as a heat sink substrate for power modules, IGBTs, power electronics and RF devices for high power electronics and power systems
  • LED Lighting: Used as a heat dissipation substrate in LED packaging, it effectively conducts heat and ensures electrical insulation to improve the life of the lamps and lanterns.
  • Communication and 5G: As a material for high-frequency antenna substrates and RF devices, Aluminum Nitride has a high dielectric constant (≈8.5) and low signal loss in the tens of GHz frequency band.
  • Automotive electronics and aerospace: used in automotive electronic control units, electric vehicle power electronic modules, spacecraft electronic systems, etc., to meet severe temperature and reliability requirements.
  • Industrial and military: such as high-power lasers, military radar, nuclear industry and other areas that require high-temperature stability and reliability.

Product Advantage Comparison

  • Metal/stainless steel:Conventional metals (e.g. copper, stainless steel) have high thermal conductivity, but they are electrically conductive and dense, so they are not suitable for use as insulating heat dissipation components. Aluminum nitride thermal conductivity of about 170-230 W / (m-K), although lower than copper (≈ 400 W / (m-K)), but has a high resistance, low density (3.26 g / cm ³) advantage, is an ideal insulation alternative material for efficient heat dissipation.
  • Aluminum oxide ceramics:Common α-Al₂O₃ ceramics are wear-resistant and insulating, but have a thermal conductivity of only about 20-30 W/(m-K). In contrast, aluminum nitride has a thermal conductivity 5-10 times higher, which can significantly improve the thermal performance of electronic devices.
  • Zirconia ceramics:ZrO₂ ceramics have excellent toughness, but very low thermal conductivity (~2-3 W/(m-K)) and high density (≈6.0 g/cm³). Aluminum nitride, on the other hand, combines high thermal conductivity and insulating properties with a density that is only about half that of zirconium oxide, improving the material's thermal efficiency and reliability.
  • Why choose us:Zhihao Ceramics has many years of experience in precision ceramics R&D and manufacturing, with strict and stable production process and quality control. Our products have passed ISO9001 quality certification. We offer a wide range of Aluminum Nitride ceramic substrates with customized dimensions and surface treatments, making us a reliable partner for you.

Difference between Aluminum Nitride Ceramics and Boron Nitride Ceramics

Performance Comparison Table

Performance indicators Aluminum Nitride Ceramics (AlN) Boron nitride ceramics (BN)
chemical formula (e.g. water H2O) AlN BN
crystal structure hexagonal lattice c-BN (cubic), h-BN (hexagonal)
heat conductivity 170-200 W/m-K 30-200 W/m-K
Electrical properties Excellent insulation h-BN insulation, c-BN local semiconductor properties
Hardness and strength Medium, good toughness c-BN is super hard, h-BN is softer and easier to machine
temperature resistance Limited stability at high temperatures h-BN high temperature and oxidation resistance
typical pattern Ceramic Substrates, Ceramic Sheets Powders, Blocks, Tools, Coatings
(manufacturing, production etc) costs moderate Differs greatly depending on crystal type

Aluminum nitride ceramics (AlN) and boron nitride ceramics (BN) are both high-performance inorganic non-metallic materials, but their properties and applications are focused. Aluminum nitride chemical formula for AlN, the crystal structure is stable, the most important feature is high thermal conductivity (170-200 W/m-K) and excellent electrical insulation, and the coefficient of thermal expansion and silicon chips close to, so widely used in power electronic modules, LED heat dissipation substrate and new energy electronic control system, is an important electronic industry, heat dissipation and insulation materials. Boron nitride is divided into cubic boron nitride (c-BN) and hexagonal boron nitride (h-BN). c-BN hardness is second only to diamond, wear-resistant, commonly used in cutting tools and wear-resistant coatings; h-BN structure is similar to graphite, has a good insulating, lubrication and high temperature performance, can be oxidized under the atmosphere of long-term work, suitable for high-temperature lubricant, heat insulation and spacecraft protection materials. In contrast, aluminum nitride ceramics known for high thermal conductivity, strong insulation, suitable for electronic packaging and heat dissipation scenarios; boron nitride ceramics due to the different crystal types, both as super-hard wear-resistant materials, but also as a high-temperature insulation and lubrication materials. As a result, the two present a complementary relationship in modern industry: the former focuses on electronic thermal management, while the latter serves more in extreme environments and machining areas.

Production process and quality control

ZhiHao Ceramics adopts a mature preparation process to produce aluminum nitride ceramic substrate: high purity AlN powder and a small amount of sintering additives are mixed uniformly, and then the billet is isostatically pressed; then sintered under nitrogen or inert atmosphere, hot isostatic pressure, so that the billet is densified. After sintering, the blanks are precision machined and surface polished. Comprehensive dimensional and performance testing is implemented during the production process, including dimensional measurements, thermal conductivity, resistivity and other tests to ensure stable and reliable performance of each batch of products. We have a perfect quality system and testing standards to provide customers with high quality and low failure rate aluminum nitride ceramic products.

About Us

Shenzhen Zhihao Precision Ceramics Co., Ltd. is a professional manufacturer of advanced ceramic materials, focusing on the research, development and production of high-performance inorganic non-metallic materials. The company has many years of experience in ceramic R&D and perfect production system, with the ability of the whole process of precision ceramic molding, sintering and machining. We have a number of ceramic material invention patents, and through the ISO9001 and other quality management system certification, products are widely used in electronics, semiconductor, aerospace, energy and other fields. Zhihao Ceramics is committed to providing customers with reliable ceramic solutions, and to win the trust of the market with excellent products and services.

Frequently Asked Questions FAQ

Aluminum nitride is an inorganic non-metallic ceramic material (advanced ceramics) with the chemical formula AlN.It has a fibrillated zincite-type hexagonal crystal structure and is a covalently bonded wide bandgap semiconductor.

The chemical formula for aluminum nitride is AlN.

Aluminum nitride crystal structure is hexagonal fibrous zincite type crystal system, the crystal is hard and brittle.

The thermal conductivity of aluminum nitride is about 170-230 W/(m-K), which is much higher than that of ordinary alumina ceramics.

Aluminum nitride has a relative dielectric constant of about 8.5, which gives it low signal loss in high frequency (RF) applications.

Aluminum nitride is non-conductive; it is an electrically insulating material with a resistivity that can exceed 10^13 Ω-cm at room temperature.

Aluminum nitride hydrolyzes when exposed to water, producing aluminum hydroxide and ammonia. Therefore, it needs to be sealed or stored dry in a humid environment to maintain stable performance.

Aluminum nitride is mainly used in electronic circuits and devices that require efficient heat dissipation, such as power module heat dissipation substrates, LED package substrates, semiconductor carrier boards, RF antenna substrates, power electronic components, etc.

Aluminum nitride is not a salt in the chemical sense; it is a covalently bonded ceramic material with no metal ions and does not belong to the general class of salts.

Generally speaking, “ceramics” refers to fired products made of inorganic non-metallic materials, while “porcelain” usually refers to daily utensils made of kaolin and other raw materials fired at high temperatures, which is a kind of ceramics. Aluminum nitride, as a high-tech ceramic material, is significantly different from traditional daily-use porcelain in terms of composition and application.

Stay up to date with the latest news.

Follow us to learn more about advanced ceramics.

Latest Articles

Let us answer your questions

Call Now (86)14775525696

Let's start here.